Fibocom Auto Inc. Makes a Wonderful Appearance at the 2023 Qualcomm Automotive Technology and Cooperation Summit, Taking the Development of Intelligent Connected Vehicles to a New Level
On May 25-26, the 2023 Qualcomm Automotive Technology and Cooperation Summit, with the theme of "Let's Redefine Cars Together," was held in Suzhou High Speed Rail New City. As an important partner of Qualcomm, Fibocom Auto Inc. was invited to participate in this summit, gathering with numerous industry partners, upstream and downstream manufacturers of the automotive industry chain, and over 1000 industry representatives to jointly draw a new ecological landscape of intelligent connected vehicles!
At the summit, Wu Ronghua, General Manager of Fibocom Auto Inc. Product Center, delivered an important speech on the innovation of intelligent connected vehicle technology, He talked about: Fibocom Auto Inc. focuses on the car front end market and is committed to developing software and hardware products such as T-Box, intelligent cockpit, car software, and technical services. It has launched car level modules that cover wireless communication technologies such as 5G, 4G, and C-V2X. Currently, the user experience and industry insiders are drivingFibocom Auto Inc. in reverse to achieve Chinese style services and iterative innovation for internet connectivity and cockpit! Intelligent connection, everything is born, and we closely follow Qualcomm's digital base products and technologies to build 5 G car networking products, cost-effective intelligent cockpit service ecosystem, accelerate industry innovation, achieve user experience, and become the most knowledgeable module provider of intelligent networking!”
Fibocom Auto Inc. appeared at the summit with multiple SOC+MDM modules, demonstration vehicles, and solutions. With its powerful performance and stable and outstanding intelligent experience, Fibocom Auto Inc. once again gained popularity and attracted people to exchange and discuss, demonstrating extraordinary research and development capabilities。
Currently, the improvement of integration and complexity in the field of intelligent cockpit has put forward higher requirements for the computing power of communication modules in the cockpit.Fibocom Auto Inc. is AL656S high-performance cockpit SoC module, based on the Qualcomm QCM6125 platform, is installed on numerous mass-produced models of GAC Trumpchi and GAC Aian, helping GAC create a concierge level technology cockpit. It supports high-resolution central control screens, is equipped with the ADiGo 4.0 intelligent IoT system, and supports rich vehicle ecosystem applications. It provides convenient AI voice control, online real-time navigation, 360 view, fast reverse imaging, remote vehicle control, and other intelligent experiences< Br/>At the same time, there is the AN958 series of 5G R15 communication module based on Qualcomm SA515M, which is installed in various models of Geely, helping Geely Automobile release the first batch of mass production models that support 5G, providing users with a high-speed and low latency network experience. From various dimensions such as high computing power, high intelligence, and high cost-effectiveness, Fibocom Auto Inc. moped up the "smart" high point in the automotive market< Br/>
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At present, Fibocom Auto Inc. has collaborated with more than 20 car companies and 30+tier1 based on intelligent modules, including application scenarios such as intelligent cockpit, T-BOX, in car navigation, and intelligent car machines. Multiple projects have been commercially launched, with a shipment quantity of over 8 million pieces. For many years, Fibocom Auto Inc. has maintained close cooperation with Qualcomm. With deep technological accumulation in the fields of wireless communication and mobile computing, Fibocom Auto Inc. has launched a rich range of products and solutions for intelligent vehicles, constantly refreshing the top-level experience of intelligent connected vehicles. In the future, Fibocom Auto Inc. will lead the automotive industry towards a new era of intelligent connectivity with its digital and intelligent innovation capabilities.